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Soldering Profiles

Microsemi CMPG and our contractors evaluate products and their reflow classification temperatures in accordance with the IPC/JEDEC standard J-STD-020 as follows:

Products Using Pb-Free Process

Pkg. Thickness <1.6 mm	260°C
Pkg. Thickness 1.6?2.5 mm and Volume <350 mm3	260°C
Pkg. Thickness 1.6?2.5 mm and Volume 350-2000 mm3	250°C
Pkg. Thickness 1.6?2.5 mm and Volume >2000 mm3	245°C
Pkg. Thickness >2.5 mm and Volume <350 mm3	250°C
Pkg. Thickness >2.5 mm and Volume ?350 mm3	245°C

Products Using SnPb Eutectic Process (limited availability)

Pkg. Thickness ?2.5 mm	220°C
Pkg. Thickness <2.5 mm and Volume <350 mm3	235°C
Pkg. Thickness <2.5 mm and Volume ?350 mm3	220°C

The graphical image and corresponding table below show the typical soldering profile conditions used for Microsemi CMPG devices based on assembly materials and type.

Profile

 

Profile Feature	Sn-Pb Eutectic Assembly	Pb-Free Assembly
Preheat
Temperature Min (Tsmin)	100°C	150°C
Temperature Max (Tsmax)	150°C	200°C
Time (min to max) (ts)	60-120 seconds	60-120 seconds
Tsmax to Tp
- Ramp-up Rate	3°C/second max.	3°C/second max.
Time maintained above:
- Temperature (TL)	183°C	217°C
- Time (tL)	60-150 seconds	60-150 seconds
Peak package body temperature (Tp)	Refer to previous table	Refer to previous table
Time (tp) within 5°C of classification temperature (Tc)	20 seconds	30 seconds
Ramp-down Rate (Tp to Tsmax)	6°C / second max.	6°C / second max.
Time 25°C to Peak Temperature	6 minutes max.	8 minutes max.

Notes

1.	All temperatures refer to topside of the package, measured on the package body surface.
2.	These reflow profiles are for classification/preconditioning and are not meant to specify board assembly profiles
3.	SMD packages previously classified to a given moisture sensitivity level by using previous revisions of J-STD-020 do not require reclassification unless a change in level or peak temperature is desired.