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| Global Tree | > | Communications | > | Circuit Emulation Services over Packet | > | ZL50120 |
| Related Products | ||
| ZL50119 | 64 Channel (2 T1/E1) CESoP Processor with dual Ethernet interface | |
| ZL50118 | 32 Channel (1 T1/E1) CESoP Processor with dual Ethernet interface | |
| ZL50117 | 128 Channel (4 T1/E1, 1 T3/E3/STS-1) CESoP Processor with single Ethernet interface | |
| ZL50116 | 64 Channel (2 T1/E1) CESoP Processor with single Ethernet interface | |
| ZL50115 | 32 Channel (1 T1/E1) CESoP Processor with single Ethernet interface | |
| ZL50114 | 128 Channel (4 T1/E1) CESoP Processor with Dual Ethernet Interface | |
| ZL50111 | 1024 Channel (32 T1/E1, 2 T3/E3) CESoP Processor with triple Ethernet interface | |
| ZL50110 | 256 Channel (8 T1/E1) CESoP Processor with Dual Ethernet Interface | |
ZL50120 PRODUCT PROFILE
128 Channel (4 T1/E1, 1 T3/E3/STS-1) CESoP Processor with dual Ethernet interface
Product Status: Production
Overview
The ZL50120 CESoP processor is a highly functional TDM to Packet bridging device providing both structured and unstructured circuit emulation services (CES) for T1 and E1 streams across a packet network based on MPLS, IP or Ethernet. The ZL50120 also supports unstructured J2, T3, E3 and STS-1. The device incorporates a range of powerful clock recovery mechanisms for each TDM stream and a dual Ethernet interface to aggregate data traffic with voice traffic.
Features & Benefits
- Circuit Emulation Services over Packet (CESoP)transport for MPLS, IP and Ethernet networks
- On-chip timing & synchronization recovery across a packet network
- On-chip dual reference Stratum 3 DPLL
- Grooming capability for Nx64 kbps trunking
- Fully compatible with Zarlink's ZL50110, ZL50111 and ZL50114 CESoP processors
- TDM Interface provides 128 bi-directional 64 Kbps channels or 4 T1/E1, 1 J2, 1 T3/E3, or 1 STS-1 ports
- Compatible with H.110, H-MVIP, ST-BUS backplane
- Direct connection to LIUs, framers, backplanes
- 100 Mbps MII interface for user data traffic
- 100 Mbps MII FE or 1000 Mbps GMII/TBI interface for network uplink
- Flexible, multi-protocol packet encapsulation including IPv4, IPv6, RTP, MPLS, L2TPv3, ITU-T Y.1413, IETF CESoPSN, IETF SAToP and user programmable
- Complies with ITU-T recommendation Y.1413, IETF PWE3 draft standards CESoPSN and SAToP and CES draft IAs from MEF and MFA
- On-chip packet memory with 128 ms jitter buffer
Technical Documents
Documentation
Design Manuals
- zl50115-20-secure-memory-estimator-apr2005.xlsPlease login to access protected documents.
- zl5011x-full-design-manual-feb-2009.pdfPlease login to access protected documents.
- zl5011x-ethernet-bandwidth-estimator-aug2005.xls
Software Manuals
- zl50115-16-17-18-19-20-full-programmers-model-jan2005.pdfPlease login to access protected documents.
- zls50111-full-api-userguide-nov2008.pdfPlease login to access protected documents.
Application Notes
- List of ZL5011x Application Notes - May 2009Please login to access protected documents.
- ZLAN-156 (secure) - Applications of the CESoP ProcessorsPlease login to access protected documents.
- ZLAN-138 (secure) - Applications of the CESoP ProcessorsPlease login to access protected documents.
- ZLAN-139 (secure) - MT9076 Framer with ZL5011xPlease login to access protected documents.
Product Previews
Tools & Software
Downloads, Firmware and Drivers
- BSDL Files:
- zl50120gag.bsd
- IBIS Models:
- zl50120gag.ibs
- PCB Design Files:
- zle50110-1-4-pcb-design-files.zip
Evaluation Boards
Applications
Typical Applications
- TDM traffic over packet networks
- Leased Line support over packet networks
- 3 G Wireless Backhaul
- TDM over Cable
- TDM over WiFi (802.11x)
- TDM over WiMAX (802.16)
- FTTx (Fibre To The Premises)
- G/E PON (Passive Optical Networks)
- Layer 2 VPN services
- Customer-premise and Provider Edge Routers and Switches
- Ethernet and IP based IADs
- IP DSLAM, NG-DLC
- MDU/MTU
Packaging & Availability
Product Packaging & Availability
| Part Number |
Package Type |
Pin Count |
Lead-Free Option |
Shipping Option(s) |
Lead Time(wks) |
Status |
|---|---|---|---|---|---|---|
| ZL50120GAG | PBGA | 324 | Trays. Bake & Drypack | 6-8 weeks | Production | |
| ZL50120GAG2 | PBGA | 324 | Pb-free-Tin/Silver/Copper | Trays. Bake & Drypack | 6-8 weeks | Production |
Packaging Information
Support
Technical Support
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