The ZL30314 is a member of a family of footprint-compatible devices offering the full range of features required for timing and synchronization across packet networks.  These are the only commercially available single chip devices to offer both packet timing using IEEE-1588 Precision Time Protocol (PTP) and Synchronous Ethernet (SyncE) for physical layer timing. The ZL30314 offers a full Stratum 3 (SDH) DPLL, ideal for Timing Card applications and supports clock recovery over L2 and L3 networks for all wireless applications. The ZLE30320 reference design  operates as a standalone IEEE 1588-2008 server/ grandmaster or client, in addition to fulfilling the requirements of Synchronous Ethernet, to help speed the design of new equipment or retrofit existing equipment. For more, visit the ZLE30320 IEEE 1588 & SyncE Reference Design profile page.

Features & Benefits

• Recovers and transmits network synchronization over Ethernet, IP, MPLS networks
• Capable of server, client and repeater operation
• Integrates two separate digital phase locked loops
• Recovers clocks from two independent servers, with hitless switching between packet streams for redundancy
• Hitless switching from Packet to Packet, Packet to Electrical, Electrical to Packet
• Accepts eight input references, and up to three associated low frequency alignment or framing pulses
• Generates up to four separate output clocks at frequencies between 8 kHz and 100 MHz
• Generates two separate Synchronous Ethernet clocks to drive industry standard Ethernet PHY devices at either 25 MHz or 125 MHz
• Two independently configurable MAC interfaces, supporting both Fast Ethernet and Gigabit Ethernet for Wire-speed timestamping of ingress and egress IEEE1588 messages
• Full demonstration & evaluation platform available

Documentation

• zl30314-full-datasheet-jun09.pdfPlease login to access protected documents.
• zl30314-datasheet-jun09.pdf
• ZL30314 Register MapPlease login to access protected documents.

Design Manuals

Software Manuals

• ZL303xx API Reference ManualPlease login to access protected documents.

Application Notes

• ZLAN-296 Applications of the ZL30320 Linux Software Porting GuidePlease login to access protected documents.
• ZLAN-287 Applications of the ZL303xx Hybrid ClockPlease login to access protected documents.
• ZLAN-261 Applications of the ZL303xx Bring-up Scripts
• ZLAN-294 Understanding New Char Driver with FPEPlease login to access protected documents.
• ZLAN-68 TOP - List of Oscillators that can be used with Zarlink's ToP DevicesPlease login to access protected documents.
• ZLAN-252 - Perform IEEE 1588v2 PTP Testing Using the ZLE30320 KitPlease login to access protected documents.
• ZLAN-221 - ZL30310 Reference Design - Based on the ARM9 ProcessorPlease login to access protected documents.
• ZLAN-222 - Application of the ZL303x0 Family - Host InterfacePlease login to access protected documents.
• ZLAN-227 - ZL303xx Ethernet Interfaces Reference DesignPlease login to access protected documents.
• ZLAN-234 - ZL30310 Reference Design - Based on the MPC8313 ProcessorPlease login to access protected documents.
• ZLAN-250 - Applications of the ZL303xx Using 1 Hz At Server & ClientPlease login to access protected documents.
• ZLAN-251 - Applications of the ZL303xx - Debug StepsPlease login to access protected documents.

Product Previews

• ZLE30320 IEEE 1588 & SyncE Reference Design Product Preview
• ToP-product-preview-jun09.pdf

Downloads, Firmware and Drivers

BSDL Files:
• zl30314gkg.bsd

IBIS Models:
• zl30314.ibs

Typical Applications

• IEEE 1588 and Synchronous Ethernet timing
• GSM and UMTS air interface synchronization over a packet network
• Circuit Emulation Services over Packets
• IP-PBX and VoIP Gateways
• Video Conferencing
• Broadband Video Distribution

Product Packaging & Availability

Part Number	Package Type	Pin Count	Lead-Free Option	Shipping Option(s)	Lead Time(wks)	Status
ZL30314GKG	TEBGA-2	256		Trays. Bake & Drypack	10-12 weeks	Production
ZL30314GKG2	TEBGA-2	256	Pb-free-Tin/Silver/Copper	Trays. Bake & Drypack	10-12 weeks	Production

Packaging Information

• Soldering Profiles
• Moisture Sensitivity
• Shelf Life
• Reliability Data

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