Device Shelf life, Storage and Soldering
Zarlink Semiconductor product may be stored for extended periods before use provided that storage conditions are well controlled. Evaluation of devices has shown solderability is acceptable after a period of three years from the time the tin/solder plate or solder dip was applied to the devices.
Zarlink Semiconductor guarantees that all product which is shipped to customers within 3 years of our assembly of the devices meets our standard quality requirements. Note that the date code on the device is the date of assembly / lead finish processing.
Product characterization, reliability qualification and monitoring program performed by Zarlink Semiconductor demonstrate that no quality degradation should be observed over time if the product is used within the conditions specified within product data sheets
Non dry pack devices should be shielded from electrostatic charge and stored in conditions not exceeding 30°C/60%RH.
Moisture sensitive product (SMD's) that are supplied by Zarlink Semiconductor in dry packs will need to be rebaked as stated above and repackaged every twelve months unless stored in conditions not exceeding 20% RH. See "Moisture Sensitivity (SMD)" for more details.
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