Soldering Profiles

Zarlink Semiconductor and our contractors evaluate products and their reflow classification temperatures in accordance with the IPC/JEDEC standard J-STD-020 as follows:

 

Products Using Pb-Free Process
Pkg. Thickness <1.6 mm 260°C
Pkg. Thickness 1.6-2.5 mm and Volume <350 mm3 260°C
Pkg. Thickness 1.6-2.5 mm and Volume 350-2000 mm3 250°C
Pkg. Thickness 1.6-2.5 mm and Volume >2000 mm3 245°C
Pkg. Thickness >2.5 mm and Volume <350 mm3 250°C
Pkg. Thickness >2.5 mm and Volume ≥350 mm3  245°C

Products Using SnPb Eutectic Process (limited availability)
Pkg. Thickness ≥2.5 mm 220°C
Pkg. Thickness <2.5 mm and Volume <350 mm3 235°C
Pkg. Thickness <2.5 mm and Volume ≥350 mm3 220°C

 

The graphical image and corresponding table below show the typical soldering profile conditions used for Zarlink Semiconductor devices based on assembly materials and type.

 

Profile

 

 Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Preheat
  - Temperature Min (Tsmin)
  - Temperature Max (Tsmax)
  - Time (min to max) (ts)
100°C
150°C
60-120 seconds
150°C
200°C
60-120 seconds
Tsmax to Tp    
  - Ramp-up Rate 3°C/second max. 3°C/second max.
Time maintained above:    
  - Temperature (TL) 183°C 217°C
  - Time (tL) 60-150 seconds 60-150 seconds
Peak package body temperature (Tp) Refer to previous table Refer to previous table
Time (tp) within 5°C of classification temperature (Tc) 20 seconds 30 seconds
Ramp-down Rate (Tp to Tsmax) 6°C / second max. 6°C / second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.

 

Notes

1. All temperatures refer to topside of the package, measured on the package body surface.
2. These reflow profiles are for classification/preconditioning and are not meant to specify board assembly profiles
3. SMD packages previously classified to a given moisture sensitivity level by using previous revisions of J-STD-020 do not require reclassification unless a change in level or peak temperature is desired.


Hot News

  1. Feb 3, 2010 - Product Zarlink and Freescale Target Wireless Network Upgrades to Support High Bandwidth Smartphone Services
  2. Jan 28, 2010 - Corporate Zarlink Third Quarter Fiscal 2010 Revenue Exceeds Guidance
  3. Jan 18, 2010 - Corporate Zarlink Reconfirms Timing of Third Quarter Earnings Release