Hybrid Technology Specification
Standard 20"/40" Ceramic (96% Allumina)Thick Film Print & Fire Process - Track & Gap 6"
Printed Resistors 1 Ohm - 30 Mohm - Resistor trimming (0.5% Tolerances)
Printed Capacitors < 1pF
50" & 100" Leadframe (Inc. SIL, DIL & Gull Wing)
Turnaround time : 5 weeks
MultiLayer double sided custom solutions - 10ppm Reliability
SMT Component placement
Full Parametric Testing
Lead Free : WEE directive conformance

Processes & Technologies
Resources
Priviledged Sites
Collaborative Projects
- SIMM Project (Self-Energizing Implantable Medical Systems)
- SHIFT Project (Smart High-Integration Flex Technologies)
- Healthy Aims
- More...
Service & Quality
Related Resources
- Medical Communications
- Timing & Synchronization
- Hybrid Technology Specification
- BGA 'Sip' Specification
- Micro-module Assembly Specification
- More...
