Micro-module Assembly Specification

Assembly (Class 1000 Cleanrooms)

Platform : Ceramic, Flex, IPC, LCC
Wirebond : 25um / 32um (Au & Al)
Flip Chip : Flux & Underfill (Inc. Shear check)
Pick & Place (waffle Tray & Wafer Frame) : Silicon & 'implantable grade' discretes - +/- 5um placement Accuracy
Hermetic Lid Seal : Reflow
Permanent Lid Marking : Videojet Ink System (traceability to individual wafer)

Quality Assurance (MIL 883)

Hermetic Verification : Helium (Fine & Gross leak)
Computerised WIP Tracking : All Process steps - SAP
Vibration (Centrifuge) : 30,000G
Temperature Cycling : 100% (-65 - +150C typical) 10 cycles
Life Test (Burn-in) : 100% Biased
100% Electrical Testing : Full Parametric (LTX, Eagle, Custom)
Lot Acceptance Testing (LAT) : Group A,B,C & D (MIL 883)