- Build to Print and Custom Design modules on Ceramic, PCB or System in a Package(SIP) BGA for Telecom markets
- Designed the worlds smallest Network Timing Module for stratum 3,OC 12 application using SIP technolgy
- Design for Manufacture and Value Engineering review
- Design expertise in high reliability communications (SLICs and COICs) and wireless communications in ISM bands (433MHz and 2.4GHz wireless LAN)
- Knowledge of telecom standards world wide
- Sample and stepped volume production
- High Voltage Isolation
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